Calling All Package Designers!
We Invite You To Participate in The Dieline Awards 2013
Registration is NOW OPEN for the 4th Annual The Dieline Package Design Awards – Presented by Inwork. The awards are a worldwide competition devoted exclusively to the art of consumer package design.
The awards are judged by a highly esteemed panel of 10 industry experts from around the world. 42 winners across 13 different categories will be awarded a 1st, 2nd, or 3rd place Award. The highest scoring project will receive a one-of-a-kind “Best of Show” award, and a session at The Dieline Package Design Conference 2013 in San Francisco.
From major consumer packaged goods companies, to individual designers, to student projects, The Dieline Package Design Awards have had the privilege to award some of the best package design work in the industry. Check out our past winners here.
View full post on TheDieline.com – Package Design Blog
The Dieline Package Design Awards 2013: Registration NOW OPEN!
We are so excited to announce that registration is NOW OPEN for the 4th Annual The Dieline Package Design Awards!
The awards are judged by a highly esteemed panel of 10 industry experts from around the world, and awarded based on Creativity, Marketability, and Innovation. Debbie Millman, President Emeritus of AIGA and President of Design at Sterling Brands, serves as the chairwoman of the judges.
For the 2013 edition, 42 winners across 13 different categories will be awarded a 1st, 2nd, or 3rd place Award, and the highest scoring project will receive a one-of-a-kind “Best of Show” award, and a session at The Dieline Package Design Conference 2013 in San Francisco.
MORE INFORMATION >
View full post on TheDieline.com – Package Design Blog
Announcing: The Dieline Package Design Awards 2013 – Presented by Inwork
We are so excited to announce the launch of the 4th Annual The Dieline Package Design Awards!
The Dieline Package Design Awards 2013 – Presented by Inwork is woldwide competition devoted exclusively to the art of consumer package design. The Dieline Awards were launched in 2009 in order to bring more awareness to the importance of well-designed packaging.
The awards are judged by a highly esteemed panel of 10 industry experts from around the world, and awarded based on Creativity, Marketability, and Innovation. Debbie Millman, President Emeritus of AIGA and President of Design at Sterling Brands, serves as the chairwoman of the judges.
For the 2013 edition, 42 winners across 13 different categories will be awarded a 1st, 2nd, or 3rd place Award, and the highest scoring project will receive a one-of-a-kind “Best of Show” award, and a session at The Dieline Package Design Conference 2013 in San Francisco.
An “Editor’s Choice” award will also be given out, handpicked by Andrew Gibbs, Founder of The Dieline.
Registration Opens Jan 1st.
View full post on TheDieline.com – Package Design Blog
Leave a commentThis Week’s Top 10 Package Designs
Check out this week’s Top 10 Package Designs on The Dieline below, based on popularity. Which one are you most inspired by?
View full post on TheDieline.com – Package Design Blog
Call For Speakers & Save The Date: The Dieline Package Design Conference San Francisco
Brand strategies are now being built from the package outward – but a major shift happening now is towards the package design architecting all brand touch points based on the brand expression centering in the package design.
Brands, and designers are beginning to understand the value of starting with the package first. The Dieline Package Design Conference 2013 will show package designers how to extend the perception of their expertise and how to vocalize and be more articulate about what their design means to their brand.
We want to teach package designers to be better at considering the role of design in improving sales of a product, and to create meaningful differentiation. There are lots of beautiful designs out there, but not many are reinventing the perceptions of product benefits or paying off on shifting, emerging cultural ideology. We would like to change that.
The Dieline Package Design Conference 2013 will give package designers the language and tools to convince higher ups that their design is truly communicating to the brand target. We will elevate the role of package designers beyond craftsmanship discussions, and have more talks about becoming more influential and in demand, and how to become industry leaders.
Our goal is to go beyond presentations about geeking out on typography or what colors are in this year; The Dieline Conference 2013 will take a larger role of elevating the role of the package design and the package designer.
Interested in speaking at, sponsoring, exhibiting, or have questions about The Dieline Package Design Conference 2013?
Please contact Andrew Gibbs for more information at andrew@thedieline.com.
The Dieline Package Design Conference will take place on June 23-26 in San Francisco, CA.
View full post on TheDieline.com – Package Design Blog
The Dieline Package Design Awards Exhibit in Paris
I just returned last week from our first ever The Dieline Package Design Awards Exhibit, in the magnificent city of Paris! It was such an honor to have our 2012 Winner’s packaging on exhibit in the heart of Paris, steps from the Louvre.
I started The Dieline with the goal of sharing what I believe represents well designed packaging with the world. I wanted to elevate, and put a spotlight on the package design industry, and show everyone from designers to consumers that goes into the art of brand packaging. This exhibit is an extention of that goal. From over 800 entries, these projects truly represent the best of the best package designs across the globe over the past year.
The exhibit is presented by The Dieline, Diadeis, and the DesignPack Gallery, and is located underground in the Palais Royale / Musee De Louve metro stop. One of the most trafficed in Paris, over 3,000 people a day will walk by The Dieline Awards 2012 winners!
If you are in or around the Paris metro area, the winners will be on exhibit until November 17th. After that, the exhibit will be moved to the Diadies booth at Emballage 2012, from November 19th to the 22nd. Emballage is one of the largest packaging tradeshows in the world, with 89,000 professions visiting every other year.
Photos from the exhibit below!
View full post on TheDieline.com – Package Design Blog
The Dieline Package Design Awards: The Winners Exhibit in Paris
Join us on Thursday, September 20th in Paris, France to celebrate our first ever gallery exhibit in Europe!
The package design and production agency Diadeis and the Designpack Gallery presents The Winners Exhibit, an exhibition of the winners for the best package designs of the year, handed out by the largest package design site in the world: The Dieline.
Beginning September 21st: The Dieline Awards 2012 Winners will be exhibited at the Allée du Recyclage Gallery (Galerie de Valois/metro stop: Palais Royal – Musée du Louvre), a new underground exhibition space in the corridors of the Parisian subway outside of the Louvre.
Join The Dieline founder Andrew Gibbs, Diadeis, and the Designpack Gallery on Thursday September 20th for the Opening Reception of our exhibit.
More info and RSVP form after the jump. See you in Paris!
View full post on TheDieline.com – Package Design Blog
Exclusive Dieline Discount – The Dieline Package Design Conference
In this week’s The Wrap Newsletter we will be giving out a special Dieline-only discount code worth $230 off the Early Bird individual full-conference rate good through January 31st.
Sign up for our newsletter TODAY to get the discount code. If you’re already subscribed – you needn’t worry.
The Dieline Package Design Conference: A multi-day conference, focusing on the package design industry and its practitioners. Our flagship conference brought close to 900 attendees in its first year, so we are beyond thrilled to announce that we are back for our 2nd annual conference in Boston!
Check out: The Lineup | The Speakers | Past Events
Don’t miss out – see you in Boston!
View full post on TheDieline.com – Package Design Blog
The Dieline Package Design Awards 2012
View full post on TheDieline.com – Package Design Blog
The Dieline Package Design Conference – Boston!
We are excited to announce that The Dieline Package Design Conference is back for 2012!
This year we head to Boston! A major American epicenter of knowledge, history, and revolution.
We spent a lot of time putting this second conference together, so we hope you find it as inspring as we have. The site is now live, so go ahead and take a look!
Also, tomorrow we will be giving out a special Dieline-only conference code worth $230 off the Early Bird individual full-conference rate good through January 31st.
The only way to get it though, is by signing up for our newsletter here. If you’re already subscribed – you needn’t worry.
View full post on TheDieline.com – Package Design Blog
